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74ABT16244A
16-bit buffer/line driver; 3-state
Rev. 06 -- 23 March 2009 Product data sheet
1. General description
The 74ABT16244A high-performance Bipolar CMOS (BiCMOS) device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT16244A is a 16-bit buffer that is ideal for driving bus lines. The device features four output enable inputs (1OE, 2OE, 3OE, 4OE), each controlling four of the 3-state outputs.
2. Features
I I I I I I I I 16-bit bus interface Multiple VCC and GND pins minimize switching noise Power-up 3-state 3-state buffers Output capability: +64 mA and -32 mA Live insertion and extraction permitted Latch-up performance: JESD 78 Class II ESD protection: N MIL STD 883 method 3015: exceeds 2000 V N CDM JESD 22-C101-C exceeds 1000 V
3. Ordering information
Table 1. Ordering information Package Temperature range Name 74ABT16244ADGG 74ABT16244ADL -40 C to +85 C -40 C to +85 C TSSOP48 SSOP48 Description plastic thin shrink small outline package; 48 leads; body width 6.1 mm Version SOT362-1 Type number
plastic shrink small outline package; 48 leads; body SOT370-1 width 7.5 mm
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
4. Functional diagram
47 1A0 46 1A1 44 5 1Y2 43 1 6 1Y3 3A3 3OE 3A2 3 1Y1 3A1 33 16 3Y2 2 1Y0 3A0 35 14 3Y1 36 13 3Y0
1 1OE 48 2OE 25 3OE 24 4OE 1A0 47 46 44 43 41 40 38 37 36 35 33 32 30 29 27 26
EN1 EN2 EN3 EN4 1 1 2 3 5 6 1 2 8 9 11 12 1 3 13 14 16 17 1 4 19 20 22 23 1Y0 1Y1 1Y2 1Y3 2Y0 2Y1 2Y2 2Y3 3Y0 3Y1 3Y2 3Y3 4Y0 4Y1 4Y2 4Y3
1A2
1A3 1OE
32 25
17 3Y3
1A1 1A2 1A3 2A0 2A1 2A2
41 2A0 40 2A1 38
8 2Y0 9 2Y1 11 2Y2 4A2 4A1 4A0
30
19 4Y0
2A3 3A0 3A1
29
20 4Y1
3A2 3A3 4A0 4A1 4A2
2A2
27
22 4Y2
2A3 2OE
37 48
12 2Y3 4A3 4OE
26 24
23 4Y3
4A3
001aae231 mna996
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
2 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
1OE 1Y0 1Y1 GND 1Y2 1Y3 VCC 2Y0 2Y1
1 2 3 4 5 6 7 8 9
48 2OE 47 1A0 46 1A1 45 GND 44 1A2 43 1A3 42 VCC 41 2A0 40 2A1 39 GND 38 2A2 37 2A3 36 3A0 35 3A1 34 GND 33 3A2 32 3A3 31 VCC 30 4A0 29 4A1 28 GND 27 4A2 26 4A3 25 3OE
001aae232
GND 10 2Y2 11 2Y3 12 3Y0 13 3Y1 14 GND 15 3Y2 16 3Y3 17 VCC 18 4Y0 19 4Y1 20 GND 21 4Y2 22 4Y3 23 4OE 24
74ABT16244A
Fig 3.
Pin configuration
5.2 Pin description
Table 2. Symbol 1OE 1Y[0:3] GND VCC 2Y[0:3] GND 3Y[0:3] GND VCC 4Y[0:3] GND Pin description Pin 1 2, 3, 5, 6 4 7 8, 9, 11, 12 10 15 18 21 Description 1 output enable (LOW active) 1 data output 0 to output 3 ground (0 V) supply voltage 2 data output 0 to output 3 ground (0 V) ground (0 V) supply voltage ground (0 V)
13, 14, 16, 17 3 data output 0 to output 3
19, 20, 22, 23 4 data output 0 to output 3
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
3 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
Table 2. Symbol 4OE 3OE GND 4A[0:3] VCC GND 3A[0:3] GND 2A[0:3] VCC GND 1A[0:3] 2OE
Pin description ...continued Pin 24 25 28 31 34 39 42 45 48 Description 4 output enable (LOW active) 3 output enable (LOW active) ground (0 V) supply voltage ground (0 V) ground (0 V) supply voltage ground (0 V) 2 output enable (LOW active)
30, 29, 27, 26 4 data input 0 to input 3
36, 35, 33, 32 3 data input 0 to input 3 41, 40, 38, 37 2 data input 0 to input 3
47, 46, 44, 43 1 data input 0 to input 3
6. Functional description
Table 3. Control nOE L H
[1] H = HIGH voltage level; L = LOW voltage level; X = don t care; Z = high-impedance OFF-state.
Function table[1] Input nAx L H X Output nYx L H Z
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI VO IIK IOK IO Tj Tstg Parameter supply voltage input voltage output voltage input clamping current output clamping current output current junction temperature storage temperature output in OFF-state or HIGH-state VI < 0 V VO < 0 V output in LOW-state output in HIGH-state
[2] [1] [1]
Conditions
Min -0.5 -1.2 -0.5 -18 -50 -65
Max +7.0 +7.0 +5.5 128 -64 150 +150
Unit V V V mA mA mA mA C C
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
4 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
[1] [2]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability.
8. Recommended operating conditions
Table 5. Operating conditions Voltages are referenced to GND (ground = 0 V). Symbol VCC VI VIH VIL IOH IOL t/V Tamb Parameter supply voltage input voltage HIGH-level input voltage LOW-level Input voltage HIGH-level output current LOW-level output current input transition rise or fall rate ambient temperature in free air Conditions Min 4.5 0 2.0 -32 -40 Typ Max 5.5 VCC 0.8 64 10 +85 Unit V V V V mA mA ns/V C
9. Static characteristics
Table 6. Symbol VIK VOH Static characteristics Parameter Conditions Min input clamping voltage VCC = 4.5 V; IIK = -18 mA HIGH-level output voltage VI = VIL or VIH VCC = 4.5 V; IOH = -3 mA VCC = 5.0 V; IOH = -3 mA VCC = 4.5 V; IOH = -32 mA VOL II IOFF IO(pu/pd) IOZ LOW-level output voltage input leakage current power-off leakage current VCC = 4.5 V; IOL = 64 mA; VI = VIL or VIH VCC = 5.5 V; VI = GND or 5.5 V VCC = 0 V; VI or VO 4.5 V
[1]
25 C Typ -0.9 2.9 3.4 2.4 0.42 Max -1.2 0.55 2.5 3.0 2.0 -
-40 C to +85 C Unit Min 2.5 3.0 2.0 Max -1.2 0.55 1.0 100 50 V V V V V A A A
0.01 1.0 5.0 5.0 100 50
power-up/power-down VCC = 2.0 V; VO = 0.5 V; output current VI = GND or VCC; nOE = VCC OFF-state output current VCC = 5.5 V; VI = VIL or VIH output HIGH-state at VO = 5.5 V output LOW-state at VO = 0 V
[2]
0.1 -0.1 5.0
10 -10 50
-50 -
10 -10 50 -180 1.0 19 1.0
A A A mA mA mA mA
ILO IO ICC
output leakage current HIGH-state; VO = 5.5 V; VCC = 5.5 V; VI = GND or VCC output current supply current VCC = 5.5 V; VO = 2.5 V VCC = 5.5 V; VI = GND or VCC outputs HIGH-state outputs LOW-state outputs 3-state
-50 -
-100 -180 0.45 10 0.45 1.0 19 1.0
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
5 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
Table 6. Symbol ICC
Static characteristics ...continued Parameter additional supply current input capacitance I/O capacitance Conditions Min per input pin; VCC = 5.5 V; one input at 3.4 V and other inputs at VCC or GND VI = 0 V or VCC outputs disabled; VO = 0 V or VCC
[1][3]
25 C Typ 100 Max 250 -
-40 C to +85 C Unit Min Max 250 A
CI CI/O
[1] [2] [3]
-
4 7
-
-
-
pF pF
This is the increase in supply current for each input at 3.4 V. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. This data sheet limit may vary among suppliers.
10. Dynamic characteristics
Table 7. Dynamic characteristics GND = 0 V. For test circuit, see Figure 6. Symbol Parameter Conditions 25 C; VCC = 5.0 V Min tPLH tPHL tPZH tPZL tPHZ tPLZ LOW to HIGH propagation delay HIGH to LOW propagation delay OFF-state to HIGH propagation delay OFF-state to LOW propagation delay HIGH to OFF-state propagation delay LOW to OFF-state propagation delay nAx to nYx, see Figure 4 nAx to nYx, see Figure 4 nOE to nYx; see Figure 5 nOE to nYx; see Figure 5 nOE to nYx; see Figure 5 nOE to nYx; see Figure 5 1.1 1.3 1.6 2.3 1.5 1.6 Typ 1.7 2.1 2.7 3.5 3.0 2.4 Max 2.6 2.9 3.7 4.0 4.0 3.2 -40 C to +85 C; Unit VCC = 5.0 V 0.5 V Min 1.1 1.3 1.6 2.3 1.5 1.6 Max 2.8 3.4 4.5 4.8 4.6 4.1 ns ns ns ns ns ns
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
6 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
11. Waveforms
VI input nAx 0V t PLH VOH output nYx VOL
001aad257
VM
VM
t PHL
VM
VM
VM = 1.5 V; VOL and VOH are typical voltage output levels that occur with the output load.
Fig 4.
Input (nAx) to output (nYx) propagation delay
VI nOE input GND tPZL 3.5 V nYx output VOL
t PZH t PHZ
VM
tPLZ
VM
VOL + 0.3 V
VOH nYx output 0V
001aae233
VM
VOH - 0.3 V
VM = 1.5 V; VOL and VOH are typical voltage output levels that occur with the output load.
Fig 5.
3-state output enable and disable times
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
7 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
12. Test information
tW 90 % VM 10 % tf tr VI positive pulse 0V 10 % tW
001aac221
VI negative pulse 0V
90 % VM
tr tf 90 % VM VM 10 %
VM = 1.5 V.
a. Input pulse definition
VEXT VCC VI DUT
RT CL RL RL
PULSE GENERATOR
VO
001aac764
Test data is given in Table 8. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
b. Test circuit for 3-state outputs Fig 6. Table 8. Input VI 3.0 V fi 1 MHz tW 500 ns tr, tf 2.5 ns Load circuitry for switching times Test data Load CL 50 pF RL 500 VEXT tPHZ, tPZH open tPLZ, tPZL 7.0 V tPLH, tPHL open
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
8 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
13. Package outline
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1
D
E
A X
c y HE vMA
Z
48
25
Q A2 A1 pin 1 index Lp L (A 3) A
1
e bp
24
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions). UNIT mm A max. 1.2 A1 0.15 0.05 A2 1.05 0.85 A3 0.25 bp 0.28 0.17 c 0.2 0.1 D (1) 12.6 12.4 E (2) 6.2 6.0 e 0.5 HE 8.3 7.9 L 1 Lp 0.8 0.4 Q 0.50 0.35 v 0.25 w 0.08 y 0.1 Z 0.8 0.4 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 7.
Package outline SOT362-1 (TSSOP48)
(c) NXP B.V. 2009. All rights reserved.
74ABT16244A_6
Product data sheet
Rev. 06 -- 23 March 2009
9 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
SOT370-1
D
E
A X
c y HE vM A
Z 48 25
Q A2 A1 (A 3) Lp 1 bp 24 wM L detail X A
pin 1 index
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.8 A1 0.4 0.2 A2 2.35 2.20 A3 0.25 bp 0.3 0.2 c 0.22 0.13 D (1) 16.00 15.75 E (1) 7.6 7.4 e 0.635 HE 10.4 10.1 L 1.4 Lp 1.0 0.6 Q 1.2 1.0 v 0.25 w 0.18 y 0.1 Z (1) 0.85 0.40 8 o 0
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT370-1 REFERENCES IEC JEDEC MO-118 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 8.
Package outline SOT370-1 (SSOP48)
(c) NXP B.V. 2009. All rights reserved.
74ABT16244A_6
Product data sheet
Rev. 06 -- 23 March 2009
10 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
14. Revision history
Table 9. Revision history Release date 20090323 Data sheet status Product data sheet Change notice Supersedes 74ABT16244A_5 Document ID 74ABT16244A_6 Modifications:
* *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product data sheet Product specification Product specification 74ABT_H16244A_4 74ABT_H16244A_3 74ABT_H16244A_2
74ABT16244A_5 74ABT_H16244A_4 74ABT_H16244A_3
20060210 19981007 19980225
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
11 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
15.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
74ABT16244A_6
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 -- 23 March 2009
12 of 13
NXP Semiconductors
74ABT16244A
16-bit buffer/line driver; 3-state
17. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 23 March 2009 Document identifier: 74ABT16244A_6

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